The customer is an emerging player backed by leading global technology and engineering partners, rapidly scaling its operations to develop one of the largest data center campuses currently under construction. With planned capacity reaching multiple gigawatts, the project highlights the unprecedented scale and speed at which digital infrastructure is expanding.

With a total contract value of over €68 million, the scope includes the supply of Mega-Bay units designed to support direct-to-chip cooling architectures. These advanced systems are engineered to handle extremely high heat loads, enabling efficient and reliable thermal management in high-density computing environments.
Direct-to-chip cooling represents a significant shift from traditional air-based systems, driven by increasing processor power and the growing importance of energy efficiency. Kelvion’s solution supports this transition by delivering scalable, high-performance heat rejection technologies tailored to next-generation requirements.

“Projects of this scale and innovation level demonstrate how rapidly the data center landscape is evolving,” said Zachary Schultz, Sales Representative for the project. “We are proud to support next-generation infrastructure that is shaping the future of computing and driving demand for advanced cooling technologies.”